Signature High-Speed Interconnect Solutions

Glenair QwikConnect Magazine • July 2020 • Volume 24 • Number 3

GLENAIR • JULY 2020 • VOLUME 24 • NUMBER 3

MOVING DATA FAST IN RUGGED ENVIRONMENTS

SMALLER LIGHTER FASTER

MOVING DATA FAST IN RUGGED ENVIRONMENTS

SMALLER LIGHTER FASTER

Introduction High data-rate transmission protocols—and interconnect hardware—have undergone significant upgrades over the past decade. Glenair has stayed on the forefront of this evolution by developing contacts, connector and wiring solutions with increasingly faster and better performance. Our approach has been a mix of upgrades to traditional packaging (such as new high-speed Micro-D designs), as well as the pioneering of entirely new solutions (such as our signature differential Twinax platform, VersaLink). This special edition of QwikConnect is a fairly technical “Deep-Dive” into the underpinnings of modern-day data-transmission protocols, and how Glenair ensures optimal signal integrity and rugged environmental performance throughout our extensive range of mil-aero caliber solutions. When appropriate, we also delve into the underlying physics of high- speed (copper) datalink transmission, especially when it may help to clarify key concepts and assist application engineers in making good technology choices and designs. High-speed copper links

Signaling (Protocol)

Four factors to consider for any high-speed communication system.

Data Rate

Distance

Price / Availability

have been established, mechanical, ergonomic, and environmental requirements may be applied to select a suitable interconnect package or envelope. Given the wide array of possible environmental conditions—such as extreme operating temperature or severe levels of vibration—this is often a significant challenge, especially when it comes to the specification of suitable cable. In high-speed digital data transmission, just as with RF links, connectors must always be selected in tandem with their wiring. In this regard, the wire-to-contact termination methods and quality can massively impact system performance. As all the EE’s reading this article know, electromagnetic energy does not exactly propagate inside the wires themselves but in the materials that surround them. So the definition of a cable and contact system

Product selection for high-speed copper datalinks normally revolves around four key parameters: distance, data rate, signaling (protocol), and price/availability. Once those parameters

involves much more than just picking a wire gauge or specifying insulation thickness. The devil here truly is in the details! More about this as we go.

A standard Ethernet segment is limited to 100 m in length over Cat5 cable—adequate for wiring the IP-enabled devices within an aircraft.

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A “link budget” is an accounting of all of the power gains and losses that a fast communication signal experiences—

node-to-node, from a transmitter, through a cable to the receiver.

DISTANCE: As a preamble, lets take a look at just one of the key parameters mentioned, that of distance. The first consideration in looking at a transmission link is the distance to be traveled (and number of breakpoints). Obviously, the further a signal must travel, the more focus must be applied in budgeting for signal degradation from cable loss. In a typical local area computer network application, a node-to-node copper connection will rarely exceed the maximum allowed by conventional Ethernet standards (approximately 100 meters). This maximal distance is typically adequate to wire up computerized devices within a building—or an aircraft, spaceship, submarine, or other defined space. Beyond this distance, in-line electronics such as repeaters and re- drivers (supplied by Glenair for all protocols including USB, DVI, and HDMI) are required. Conversion to optical fiber is also a reliable option.

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Interconnect challenge: keeping pace with computer-control devices and protocols

The next distance category is computer peripherals. Distances here typically range from 0.5 meter to 15 meters. The primary consumers of high-speed bandwidth in

environmental conditions, and include PCB to I/O datalinks, board-to-board and modular disconnects, and intra-board ‘fly-over’ cable links. BREAKPOINTS: We’ve talked about distance, and made the point that there are distance limits in high- speed copper systems that play out at the network, peripheral and board levels. The next consideration in the equation is the inclusion of connector breakpoints in link budgets. Breakpoints are particularly challenging because many protocols have rigid link configurations baked into the standards (the USB standard, for example, was not written for any additional connectors in the link). The same is true for most peripheral data transmission protocols. In military and aerospace systems, a relatively hard-wired configuration does not meet the needs of most applications and link budgets, and must be re-evaluated for each additional breakpoint connector and cable length. A naval command post, for example, may be 100 feet away from a data center, and the link may need to traverse any number of bulkhead disconnects. Glenair does offer a full range of re- drivers and repeaters for these situations. These devices can be built directly into the cable side of a connector or can be implemented with an over- molded device on the cable, much like a ferrite bead.

this range are high-resolution video feeds, sensors, radars, and avionic box connections. Rapid growth of computer-control device types and applications has meant that the lifespan of chip technology is relatively short. This is evident in the rapid evolution of the high-speed protocols addressing this space (e.g. HDMI, DisplayPort). Many of the chipsets developed for these protocols are now making their way into rugged systems. But while new chipsets are easily implemented at the logic and PCB level, interconnects and cables often require more specialized development. Witness the persistence of RJ45 and legacy USB interconnects in otherwise cutting-edge application environments. The shortest links of concern to those of us in the interconnect realm are ‘inside the box.’ These connector and cable sets rarely see full system

800 N S 34° 8 48.99 “ E W 118° 14 52.49 “ DATA TRANSMISSION DISTANCES AND APPLICATION FAMILIES 600 400 200

200

400

Networks: Mainframe, server, and system-to- system networks • Dominated by Ethernet protocols • Ever-increasing bandwidths, driven by peak demand • “Tree” structure with switches and routers • Flexible configuration, user-modified as nodes are added or removed

Sensing and Control: Links between a computer and monitored or controlled devices • Ruggedized / environmental • Long connection distances (longer with re-drivers and repeater devices) • Broad range of bandwidths • “Daisy chain” configuration

Peripherals: specialized device interfaces connected to a computer • Short connection distances (a few yards maximum) • Cover a broad range of bandwidths • Serial (bit-by-bit) or Parallel (multiple data streams) • “Star” configuration

Board Level: Short- distance board-to-I/O and board-to-board • Data-intensive servers, computers and peripheral devices • Transmission rates in the 10Gb/s+ range for each data pair. • Supports serial data protocols (USB 3.1 Gen2, USB-C, SATA, PCIe, DisplayPort, and HDMI)

• Stable installation, not usually user-modified

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Board-to-board segment lengths—measured in millimeters—are still of critical concern in high data throughput applications. In the photo above, an Air Force Avionics Technician visually inspects a circuit card for a C-17 Heads-Up Display.

Data Rates and Rugged Environments

increasingly sophisticated data processing capabilities in mobile command posts, soldier systems and navy platforms. The high-data rate technologies developed in these contexts sometimes also find unexpected uses in nuclear plant applications and even quantum computers.

The relative ease of implementing high-speed copper data transmission in electronic systems has led to a rapid increase in demand for sophisticated datalinks that operate flawlessly in the most extremely rugged application environments. Data transmission rates between avionics modules onboard spacecraft, for example, continue to increase, driven by the use of processors with multi- gigabit-per-second high-speed serial data I/O’s. These complex systems support the growing data requirements of onboard sensors and increased bandwidth requirements between communications switches and satellite communication terminals. High-speed / high data rate links that can support data rates up to 10 Gbps per channel, are increasingly common in these rugged application environments. A few additional examples would include the proliferation of sub-sea, terrestrial and airborne sensor and surveillance systems, as well as the

Sensors with high-speed data links are used in flight controls, environmental monitoring, sensor systems. and so on. Photo: The NASA-ISRO SAR Mission

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THE PHYSICS OF HIGH-SPEED SIGNAL INTEGRITY Three key tools used in measuring source-to-load power losses in interconnect data links.

INSERTION LOSS: The Insertion loss of a link, or a portion of a link is a measure of the circuit resistance, or simply the amount of power lost during the transmission. For a section of a cable, the power lost follows an exponential decay per unit length. It’s important to distinguish between power and voltage, because the rules for addition for power and voltage are different. Power is a real number. AC voltage is a real number times a phase: 1 Watt plus 1 Watt is always 2 Watts But AC voltage at a given frequency: 1 Volt plus 1 Volt is anything between 0 and 2 depending on how the phases line up. Most link budgets are estimated using power, because it’s simple. But in complex links with multiple connectors, the effects of phases must be considered, resulting in insertion loss being expressed in logarithmic form: IL= Log10(power_in/power_out)

RETURN LOSS: When power is lost in a link, it can be either due to the circuit resistance (insertion loss), or it can be lost because some portion of the signal was reflected back into the link (in optical fiber transmission the same phenomenon is often referred to as back-reflection). Losing the signal to ohmic loss or to reflections has a different impact on the quality of what we receive, therefore both numbers are important when considering the quality of a connector or a cable. The cause of return losses is a change in impedance along the link, often at the connectors, but potentially originating in the cable due to a kink, sharp bend, or construction defect. Intermittent defects in a cable (for instance due to restrictions from taping or braiding) can create strong return-loss reflections at certain frequencies, as if a mirror had been inserted into the system.

This measurement of insertion loss from a HD Stacker high-speed board-to-board connector shows -3dB insertion loss at 5.6 GHz for an effective electrical bandwidth of 12 Gbps

This measurement of return loss from a HD Stacker high-speed board- to-board connector shows -3dB insertion loss at 5.6 GHz for an effective electrical bandwidth of 12 Gbps

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IMPEDANCE MATCHING: Electrical impedance, or simply “impedance,” describes a measure of opposition to alternating current (AC). Electrical impedance extends the concept of resistance to AC circuits, describing not only the relative amplitudes of the voltage and current, but also the relative phases. When the circuit is driven with direct current (DC), there is no distinction between impedance and resistance; the latter can be thought of as impedance with zero phase angle. How Impedance is Measured: A Time Domain Reflectometer (TDR) transmits a short rise time pulse along the conductor. If the conductor is of a uniform impedance and is properly terminated, the entire transmitted pulse will be absorbed in the far-end termination and no signal will be reflected toward the TDR. Any impedance discontinuities will cause some of the incident signal to be sent back towards the source. Increases in the impedance create a reflection that reinforces the original pulse, while decreases in the impedance create a reflection that opposes the original pulse. The resulting reflected pulse is displayed or plotted as a function of time, and because the speed of signal propagation is almost constant for a given transmission medium, it can be read as a function of cable length. Impedance matching is the practice of designing the input impedance of an electrical load or the output impedance of its corresponding signal source in order to get maximum power transfer from source to load. When we maximize the contact density in a connector, the conductors invariably come into closer proximity. This decreases the impedance between them. The relative Impedance can be thought of as the amount of electrical coupling there is between the conductors. Most protocols covered in digital signal transmission, require an impedance in the range of 75 to 120 Ohm. In a micro-D connector, the impedance between two adjacent contacts is on the order of 30 Ohm. In order to increase this value, we must either reduce the dielectric constant of the inserts (the best we can typically achieve is with Teflon which has a dielectric

constant of 2.2. Air has a dielectric constant of 1, (but of course using air as the dielectric in a connector is not mechanically possible). Alternatively, we can increase the spacing between contacts (sacrificing the connector’s high density). A third approach would be to maintain the same contact-to-contact spacing, but use smaller contacts overall (resulting in a lower- amperage connector). In all three cases the goal remains the same: that of maintaining a high contact density count while maximizing power transfer from source to load.

Impedance testing of differential contact pairs in multipin connectors makes allowances for ground pin separation of signal pairs. This test board has been wired for a Ground-Signal-Ground-Signal-Ground (GSGSG) method of impedance testing.

TDR testing is used to find the best balance between connector density and return loss. Depending on the application link budget, decisions can be made on which arrangements of grounds to signal contacts is optimal for a given dB return loss and frequency.

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HIGH-SPEED PLATFORMS AT GLENAIR Rugged high-speed interconnect solutions with signature contacts and contact modules for mission-critical aerospace and defense applications.

The ongoing dilemma for system engineers (and interconnect suppliers) is to design in scalable and reliable technology platforms that can keep pace with the rapid evolution in chip-level electronics, as well as the growing demand for faster and higher data rate applications. On the interconnect side, the best path forward is invariably to innovate with higher- speed and higher data rate designs that nevertheless incorporate proven modular contact designs, low- resistance crimp terminations, common mating technologies and other known “standards” of the industry. The practical consequences are that proven designs, such as verified approaches to shielding, impedance management, cross-talk and other factors are carried forward with each new technology. At Glenair we separate our high-speed offerings into two categories: 1) drop-in contact solutions (including the octaxial El Ochito), and 2) special contact / insert solutions (including SpeedMaster, and the High-speed Micro-D). The former may be packaged in industry- standard connectors, the latter are insert modules available only in Glenair Signature Series packaging. El Ochito: This size 8 Octaxial contact is a step curve improvement over Quadrax for 10/100 Base-T Quadrax aircraft Ethernet applications. Migration to higher speeds on legacy Quadrax requires splitting signals into two cables and two size 8 cavity contacts with considerable damage to signal integrity. El Ochito is a high-density solution that allows seamless upgrades to 1G and 10G Base-T. The drop-in size #8 El Ochito contact is compatible with D38999, Series 806 Mil- Aero, and other ruggedized packaging. Aerospace- grade cables with crimp termination are standard. Building on the success of El Ochito for Ethernet, we developed a version for USB 3.X protocols— distinguished by its blue color—an improved signal integrity design required for the 5-fold increase in

El Ochito ® high-speed octaxial contacts

El Ochito ® shown packaged in a SuperFly Datalink board and cable pair

Series 23 SuperNine ® with SpeedMaster™ 10G high-speed module insert

SuperSeal™ RJ45 Ethernet and USB ruggedized field connectors

Octobyte™ industrial-strength Ethernet connectors

High-Speed Micro-D: high-density solution with TwistPin contacts

VersaLink™ and VersaLink™ Bridge: differential Twinax solution shown here in Micro-D packaging

Active electronic Repeaters and Re-Drivers available for all connector series

SpeedMaster: While we are huge fans of El Ochito, not every customer needs the high density of octaxial size 8 contacts. Some prefer the flexibility of using a larger gauge wire, with AS39029 size 22 contacts and common crimp tools to terminate their high-speed interconnect. For this reason, we offer SpeedMaster connectors, with slightly larger, non-standard cavities that enable the use of the larger wire gauge and special SpeedMaster shielded contact.

base bandwidth needed by USB 3.X over 10GbE. We also offer a 100 Ohm high-speed 4-pair solution suitable for HD digital video transmission.

SuperSpeed USB

HDMI, DisplayPort, SATA

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Octobyte: Glenair Super ITS Octobyte™ connectors with Ethernet-ready contact modules (for CAT 5 to CAT 7A, and RG58 Coax) are available for harsh- environment military and industrial applications that depend on sealed environmental (IP67) connector performance. These crimp-termination (not insulation displacement) connectors deliver both dedicated Ethernet as well as mixed serial databus and power for high-speed data applications. Reverse-bayonet connectors are fast mating and deliver reliable locking performance in vibration and shock applications. SuperSeal: Military-grade, ruggedized field connectors that deliver improved environmental sealing, EMI/RFI grounding, and a broader range of wire termination options for standard commercial RJ45 and USB interconnects—now available for SuperSpeed 3.0. One unique advantage of our SuperSeal product family is that any commercial connector will be able to mate with the product. The connectors offer a wide array of cable termination options, ranging from PC Tail configurations, to “drive-thru” designs and crimp removable contacts. VersaLink: El Ochito covers a vast array of applications and protocols. The size 8 contact with 4 differential pairs has limits however. First, it obviously only comes in increments of 4 pairs and requires a size 8 cavity. If the goal is to carry as many pairs as possible in the smallest volume, and the pair quantization is not in increments of 4, then El Ochito may not be the best solution. This led to the development of VersaLink:

VersaLink Micro-D connectors, available in board-mount styles, pre-wired with pigtails, or as back-to-back cordsets.

• A single contact module for each differential pair • The highest possible density per shell size • Ample bandwidth for all common protocols • Simple, user-friendly, fast termination process • Versatile packaging: rectangular and circular • End-to-end solution: board and I/O connectors use the same electrical core. High-Speed Micro-D: The micro-D and nano-D connector families are small, high-density solutions historically used for parallel signal transmission. In fact, these are the smallest connector families available in the Mil-Aero market segment and as such are natural candidates for re-engineering to meet the signal integrity and impedance-matching specs necessary for high-speed datalink transmissions. Repeaters and Re-Drivers: Active cable technologies, geared to individual high-speed protocols, that extend distance limitations and enhance signal integrity as necessary in high-speed datalinks.

All platforms rigorously tested for signal integrity

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HIGH-SPEED PROTOCOLS IN ACTION Data networks are divided into layers, each performs a function in the transmission of data. The connectors, cables and the general electrical description of the signal (number of wires, frequency spectrum, type of modulation technique, encoding etc..) are part of the lowest layer, called the physical layer (PHY). The description of the physical layer should contain everything needed to create a link with wires and connectors. We will provide a shot description of the most commonly encountered protocols below. Ethernet The computer network standard as produced by the IEEE 802.3 working group since 1983. It has evolved from speed of a few Mb/s to 400Gb/s. The transmission medium ranges from Coax, twisted pairs to optical fiber. Readers are likely familiar with the 1000Base-T designation. The nomenclature for newer designations is shown in the table below. The encoding method scrambles the data to balance its average voltage value, X and R identify the size of

the encoding blocks. The number of lanes indicates how many data pairs (for electrical) per link. So for instance 10Base-T1 is a 10Mb/s DataStream, where the voltage is modulated directly with 1’s and 0’s over a single twisted pair (this is used in automotive and industrial applications). This nomenclature has not been implemented consistently, and short-hand descriptions are frequent. It is important to note that the physical layer will often contain a description of the connector to be used (for example, 8P8C in the table is the official name of what’s usually called an RJ45). At a minimum it will define the necessary electrical performance. A selection of popular and state-of-the-art protocol standards is provided in the table below. Ethernet cables plugged in to Ethernet switches in a server room. Photo by Jon ‘ShakataGaNai’ Davis, Wikimedia Commons

XXXXG BASE –T X 4

Ethernet Nomenclature Descriptions XXXXG : Usable speed is the amount of data per second the link can transmit BASE : Signaling spectrum refers to the frequency range used by the signaling. Baseband means there is no modulation other than the bits turning on or off. Broadband means that multiple frequency channels are individually modulated. Passband means that the signal modulation is confined to a narrow frequency band (the pass band). X , R : Encoding block size The medium designations are: T : Twisted pair wire S : Short wavelength multi-mode optical fiber (850nm) L : Long wavelength single mode optical fiber (1300nm) E (or Z): Long wavelength single mode fiber (1550nm) B : Bi-directional optical optical fiber, using different wavelengths P : Passive optical network C : Copper/Twinax K : Backplane

Ethernet Nomenclature

in Mb/s or Gb/s if followed by a G ( 10 , 100 , 1000 )

Usable Speed

Signaling Spectrum ( BASE , BROAD , PASS ) Medium Designation -T , -S , -L , -E , -Z , -B , -P , -C , -K ... Encoding Method ( X , R ) Number of Lanes ( 1 , 2 , 4 , 10 )

Popular Ethernet Protocol Standards

Name

Standard

Connector

Description

8P8C (FDDI TP-PMD standard, ANSI INCITS 263-1995)

802.3u- 1995 (24, 25)

Category 5 cable using two twisted pairs. Still very popular.

100BASE-TX

PAM-5 coded signaling, at least Category 5 cable, with

802.3ab- 1999 (40)

Category 5e copper cabling with four twisted pairs. Each pair is used in both directions simultaneously. Extremely wide adoption.

1000BASE-T

8P8C (IEC 60603-7)

802.3ap- 2007 (70) 802.3an- 2006 (55)

1000BASE‑KX

1 m over backplane

8P8C (IEC 60603-7- 4 (unscreened) or IEC 60603-7-5 (screened))

Uses Cat 6A twisted-pair wiring, four lanes at 800 MBd each, PAM-16 with "DSQ128" line code

10GBASE-T

802.3ap- 2007 (48&71) 802.3ap- 2007 (49&72)

10GBASE-KX4

1 m over 4 lanes of backplane

10GBASE-KR

1 m over a single lane of backplane

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Some readers may wonder why there is an Ethernet protocol for backplanes. This has emerged from embedded systems (or computers), where the computation capacity can be increased modularly by populating more slots in a backplane. The communication protocol of choice is still Ethernet, but the physical link is so different that it warrants its own family of specifications. USB After Ethernet, this is the most widely deployed mode of data transmission. But unlike Ethernet, it is not a network protocol and is meant to be used as a point- to-point connection between a host and a device (or several devices). As mentioned earlier, the product lifespan is shorter for devices using this protocol, and the protocol revisions are frequent. It also tends to be closer to a user and have more frequent mating cycles compared to Ethernet connections. Ruggedizing USB links is more challenging than traditional Ethernet because the signal spectrum reaches to much higher frequencies, and because the link configuration budgets do not explicitly allow for disconnect points. Evolutions of the USB standard have revolved around higher data rates and more power delivery options (battery charging and device power). The most significant recent hardware development is the USB-C connector because it merges the serial port standard with display capability; HDMI and DisplayPort can both be carried through a USB-C cable. USB 2.0 This protocol just turned 20 years old a few months ago, roughly the same age as our Mighty Mouse connector family. It’s interesting to note that to this day, a double digit percentage of our Mighty Mouse connectors we ship end up carrying USB 2.0 because that’s what most soldier systems use to connect the various devices. The maximum data transmission capability is 480Mb/s and the power delivery can go up to 100W when supporting battery charges (in more recent editions). The signal and power are delivered over 4 wires.

Glenair offers USB 3.0 connectors in ruggedized mil/aero connectors with outstanding metal-to-metal grounding and enhanced environmental sealing (IP68 in mated condition)

USB 3.0 Just 10 years after its predecessor, this protocol was a major revision in terms of speed and largely backward compatible. But with the addition of 2 SuperSpeed pairs, the link can support close to 10 times the data rate of USB 2.0. The hardware implementation looks exactly like USB 2.0 (except for USB-C cables which we will discuss in more detail below), but the electrical requirements are different. SuperSpeed USB connectors are distinguished by the blue color of their inserts. Rugged implementations of this protocol require much closer attention to signal integrity compared to USB 2.0, impedance matching through the interconnect is very important. Ensuring backwards compatibility has led to a strange nomenclature, where newer revisions of the specifications re-named the older protocols. The table below identifies the relationships between the specification, protocol, brand and data transmission rate

USB 3

Previous Name

USB-IF Branding

Transfer Speed

Specification Name

USB 3.2 Gen 1 USB 3.2 Gen 2

USB 3.1 Gen 1 USB 3.2 Gen 2

SuperSpeed USB 5Gbps SuperSpeed USB 10Gbps SuperSpeed USB 20Gbps

USB 3.0

5 Gbit/s

USB 3.1

10 Gbit/s

USB 3.2 Gen 2 x 2

USB 3.2

N/A

20 Gbit/s

Cables for USB 3.X protocols require two high-speed pairs, a power pair and the legacy data pair to support

USB 2.0. HDMI

A USB 2.0 cable. USB has become ubiquitous in our world, from computer peripherals to smartphone charging

HDMI (High-Definition Multimedia Interface) is a compact audio/video interface for transmitting uncompressed video data. It is a digital alternative to consumer analog standards, such as radio

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HDMI cable

frequency (RF) coaxial cable, composite video, or VGA. HDMI digital signals are backwards compatible with DVI (same electrical

A rugged overmolded and Santoprene-jacketed Glenair cable with a USB-C connector, designed to attach to a Juggernaut tactical EUD case.

definition, called Transmission-Minimized Differential Signaling, or TMDS). In both cases, the data stream is a combination of image data, audio data, and control information (for instance mute commands and color compatibility information). All this data is transferred over 4 high-speed differential pairs (requiring 12 pins in the connector because each pair has a ground pin). There are 7 additional pins in the connectors for separate communication channels. These are dedicated to handling specific consumer electronics situations (Audio Return, Digital Rights Protection, an Ethernet link to reduce cable clutter, and an interface for remote controls). The protocol does not specify a maximum length but a link loss. DisplayPort DisplayPort is a digital display interface standard. The specification defines a digital interconnect and data transmission for audio and video. The interface is primarily used to connect a video source to a display device such as a computer monitor (as opposed to HDMI which was originally meant for consumer entertainment systems). DisplayPort is considered more versatile than HDMI, and is able to support higher image resolutions with the same number of lanes. It also allows more flexibility with computers supporting multiple displays, which may have different resolutions.

Unlike HDMI and DVI, DisplayPort runs at fixed data transmission rates and ‘stuffs’ the channels if the full rate is not used. The standard transmission rates for each digital pair in DisplayPort are 1.62Gb/s (Reduced Bandwidth Rate or RBR), 2.7 Gb/s (High Bandwidth Rate or HBR), 5.4 Gb/s (HBR2), 8.1 Gb/s (HBR3). Future versions will add 10, 13.5 and 20 Gb/s lanes. USB-C The promise of USB-C is that it can potentially carry all the popular peripheral protocols in a single package (Ethernet, USB, DisplayPort and HDMI) as well as provide a battery charging capability. USB-C is not a single-protocol connector, rather a platform that can support multiple data and power formats. The hardware implementation consists essentially on a double USB 3.X connector, with additional discrete pins used for the connections required by HDMI and DisplayPort. The connector pin-out looks identical when flipped 180 degrees. When packaged with an orientation key, all lines can be used for signal or power transmission. The result is either a USB connector that can be plugged in “upside-down”, or a display connector that is used in only one orientation. The USB-C connector accommodates 6 differential pairs, 3 on either side (4 are shielded high-speed lanes, 2 support legacy USB 2.0 data). Interspersed among those pairs are 8 discrete pins for power and auxiliary functions. The four corner pins are signal ground pins for the SuperSpeed pair shields. The interleaving separates the high-speed data streams and improves the crosstalk performance. USB-C connectors are also compatible with Thunderbolt 3, another data transmission protocol for displays and storage devices. PCIe PCIe (Peripheral Component Interconnect express) is an inside-the-box, board-level protocol. In this context, the term “interconnect” does not refer to a mechanical connector, but rather to the link between logical units. The PCIe protocol is the data bus your

DisplayPort resolutions:The straight lines indicate screen resolutions for given aspect ratios, the curved lines show the theoretical limit of various interconnects.

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computer uses to exchange data between the main board and its daughter cards, such as a memory or a graphics card. The connector itself is usually a set of gold pads on the edge of the daughter card that plug directly into a socket on the mother board. There is a separate area of the connector for power supply and bus management, followed by clock and signal pairs. The size of the bus is measured in number of lanes, each lane consisting of two differential pairs (transmit and receive). The bus may not run all the pairs available mechanically, so it’s possible to have an X16 bus running only at X4. The data rate in PCI protocols is expressed in transfers per second instead of bits per second. For the hardware engineer, transfer-per-second is the same as bits-per-second. This is different for software engineers, because all bits are not data, i.e. there is coding overhead. A 2.5 Gb/s link only really transmits 2.0 Gb/s because of the overhead required.

Flight-Grade 100 Ohm Ethernet Cable 963-033 S/FTP Cable GLENAIR SIGNATURE CABLE FOR HIGH-SPEED PROTOCOLS 24 and 26 AWG. S/FTP construction, foil shielded data pairs. High performance shielded cable is AS6070/5 and /6 approved. 963-003 and 963-037 S/UTP Cable 24 and 26 AWG. S/UTP construction with fluoropolymer spline. Meets FAA flammability requirements. 90 Ohm USB 3.0 Cable 963-110 Flight-Grade Cable High temperature, high performance, fluoropolymer aterials, shielded. High speed pairs have braid shields. -65° to +200°C. 963-118 Commercial-Grade Cable Black PVC jacket, foamed PE wire insulation. High speed pairs have foil shields. 0 to +80°C. construction with foil shielded data pairs. High performance cable offers three jacket material options. 963-127 S/FTP HDMI and DP Cable 26 AWG, S/FTP construction, foil shielded data pairs and overall 36 AWG tin/copper. Jacket available in three material options. 963-122 S/FTP High-Speed Cable 4 data pair 26 AWG, S/FTP construction, foil shielded data pairs and overall 40 AWG silver plated copper braid. Three jacket material options. 963-033 S/FTP High-Speed Cable 26 AWG, S/FTP construction, foil shielded data pairs and overall 40 AWG silver plated copper braid. Three jacket material options. 963-043 S/F Parallel Pair High-Speed Cable 26 AWG, 1 pair S/F construction 100 Ohm, HDMI, DP and SATA Cables 963-120 S/FTP HDMI and DP Cable Aerospace grade 26 AWG, S/FTP

Data Rate (including overhead)

PCIe version

Introduced

2003 2007 2010 2017 2019

2.5Gb/s 5Gb/s 8Gb/s 16Gb/s 32Gb/s

2 3 4 5

RapidIO RapidIO is another “inside the box” data protocol. It is also used inside systems to transport data among memory and computing chips, be it on a large circuit board, from one board to another or through a backplane. The specification does not call out a connector or cable, instead it relies on electrical compliance to other specifications such as 10GBASE-KR (or 40GBase-KR). Those in turn essentially analyze the eye-diagram and set acceptable signal levels for the transmission. The implementation is often described by the number of lanes, each running maximally at 6.25Gb/s, 10.3Gb/s or 25.3Gb/s (for generation 2, 3, and 4 respectively). RapidIO deserves special attention because it is the protocol of choice for space applications and has

been utilized in many military platforms as well.

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Glenair Signature High-Speed Contact / Connector Protocol Matrix

Series 88 SuperFly® SuperFly® Datalink

Series 28 HiPer-D®

Mil-Aero

SuperNine® 38999 Type Series 792™ HS MIL-DTL-83513

Protocol

El Ochito® / Quadrax

El Ochito®/ Quadrax

High-Speed Micro-D

Series 806

SpeedMaster™

Up to: Cat 5e (1000BASE-T)

2 (1 – 2 lines)

9G5 El Ochito - White

1P1 El Ochito - White

882-001/002 El Ochito - White

9-11

11-1

Up To: Cat 6A (10GBASE-T)

2 (1 – 2 lines)

9G5 El Ochito - White

1P1 El Ochito - White

882-001/002 El Ochito - White

10-1 El Ochito - White

11-1

USB 2.0

2 (2 – 4 lines)

882-001/002 El Ochito - White (1 – 2 lines)

9G5 Quadrax

1P1 Quadrax

8-7

11-1 (1 – 2 lines)

USB 3.0 (consult factory

N/A

1P1 El Ochito - Blue

for higher versions)

9G5 El Ochito - Blue

882-009/010 El Ochito - Blue

10-1 El Ochito - Blue

eSATA/SATA

N/A

1P1 El Ochito - Red

9G5 El Ochito - Red

882-023/024 El Ochito - Red

10-1 El Ochito - Red

DVI-D Single

N/A

2P2 El Ochito Red and White

882-019/020 El Ochito - Red

14-20A El Ochito - Red

13-14 El Ochito - Red

DVI-D Dual

N/A

Contact factory

N/A

3P3 El Ochito 2-Red, 1-White

19-4 El Ochito - Red (2)

16-22 El Ochito - Red (2)

HDMI 4k @60 FPS

N/A

2P2 El Ochito Red and White

882-019/020 El Ochito - Red

13-14 El Ochito - Red

14-20A El Ochito - Red

Display Port 4k @60 FPS

N/A

2P2 El Ochito Red and White

882-019/020 El Ochito - Red

13-14 El Ochito - Red

14-20A El Ochito - Red

QwikConnect • July 2020

GLENAIR

Rugged High-Speed Interconnect Solutions Ethernet, USB, DisplayPort, HDMI, and eSATA Solutions for Mission-Critical Aerospace and Defense Applications

EL OCHITO® HIGH-SPEED OCTAXIAL CONTACTS AND CONNECTOR PACKAGING

El Ochito® high-speed octaxial contacts

SuperFly nano miniature with El Ochito®

Series 792 micro miniature with El Ochito®

Series 806 Mil-Aero micro miniature with El Ochito®

SIGNATURE HIGH-SPEED CONNECTOR SOLUTIONS

Series 23 SuperNine® with SpeedMaster™ 10G high-speed contacts

Micro-D form-factor connector with VersaLink™ differential Twinax plus VersaLink™ Bridge

High-Speed Micro-D high-density SWaP solution

RUGGEDIZED ETHERNET AND USB FIELD CONNECTORS

REPEATERS AND RE-DRIVERS

Active electronic cable components that overcome distance and signal-loss limitations in high-speed protocol applications

SuperSeal™ RJ45 Ethernet and USB ruggedized field connectors

Octobyte™ industrial-strength Ethernet connectors

QwikConnect • July 2020

HIGH-SPEED OCTAXIAL CONTACTS

® High-speed octaxial contacts for Ethernet, SuperSpeed USB and multi-gigabit datalinks

Series 792 with El Ochito octaxial contacts

10GbE, SuperSpeed USB, and multi-gigabit shielded pairs Universal drop-in for keyed size #8 connector cavities Data-pair isolation for optimal signal integrity Crimp or threaded shield termination contact types Snap-in, rear release Environmentally sealed Aerospace-grade cable assemblies fully tested and available now 50% cable / contact reduction compared to Quadrax

The shielded size #8 contact form-factor is the foundation of our next-generation octaxial contact solution, El Ochito. With the 8-contact El Ochito, any size #8 contact cavity can now support state-of-the-art high-speed protocols such as 10G Ethernet, USB 3.X, and high-resolution video displays. This high-density contact system enables seamless upgrades to higher speeds without a complete re-design of the interconnect solution. Its modular, drop-in capability allows for mixing and matching of different protocols using an identical form-factor component. Speed upgrades are immediately available in both industry standard as well as Glenair Signature connector series.

AVAILABLE SIGNATURE CONNECTOR PACKAGING INCLUDES

SuperFly Nanominiature

806 Mil-Aero Micro miniature

SuperNine “Better than QPL” 38999

HIGH-SPEED OCTAXIAL El Ochito ® Contacts Protocols, exploded views, and circuit board transition adapters

El Ochito ® White

El Ochito ® Blue

El Ochito ® Red

1000BASE-T, 10GBASE-T

SuperSpeed USB

HDMI, DisplayPort, SATA

Low-dielectric material. 90 ohms. El Ochito® Blue octaxial contacts provide an aerospace-grade solution for SuperSpeed USB 3.0

Low-dielectric material. Up to 5 Gbps. 100 ohms. El Ochito® Red octaxial contacts provide an aerospace-grade solution for multi-gigabit data rates.

El Ochito® White octaxial contacts provide 10GbE in a single size #8 contact cavity (compared to two Quadrax) for 100BASE-T solutions.

El Ochito ® Type II Contacts, Serviceable 24-26 AWG, Threaded Wire Shield Termination, Integral Contact Release Sleeve

Heatshrink Tube

Retainer Nut

O-ring

Inner Ferrule

Socket Contacts

Pin Contacts

O-ring

Front Insulator Contact Organizer Insulator

Contact Organizer Insulator

Front Insulator

Spline

Contact Release Sleeve

Alignment Key

Outer Body

Type II Pin Contact

Type II Socket Contact

El Ochito Printed Circuit Board Transition Adapters

Launch controlled-impedance signals with El Ochito® transition adapters. Accepts 90 ohm USB 3.0 cable or 100 ohm Category 6A Ethernet cable. Supplied as unassembled kit with (8) inner contacts, inner and outer insulators, bushing, outer body, crimp ferrule and mounting block. Mounting block attaches easily to circuit board with standard #0-80 fasteners.

Inner Contacts (8)

Bushing

Inner and Outer Insulators

Ferrule

Outer Body

Mounting Block

HIGH-SPEED ULTRA MINIATURE I/O DATALINKS

The Nano Miniature 10G Ethernet, USB 3.0, and DisplayPort Connector with El Ochito ® Octaxial Contact Technology

High speed, harsh environment SuperFly ® Datalink connectors— with shielded El Ochito ® octaxial contacts for 10Gb Ethernet, SuperSpeed USB, and high datarate video display protocols— deliver outstanding signal integrity and save significant size and weight compared to Quadrax. Ultra-small size

Shielded Octaxial contacts Up to 5 Gbps (even faster options in development) 10Gb Ethernet and SuperSpeed USB New Red insert for high- speed video, consult factory for layouts Environmentally protected Factory-terminated cables or discrete components for customer assembly

SuperFly Datalink White

SuperFly Datalink Blue

SuperFly Datalink Red

1000BASE-T Ethernet 10G Ethernet

USB 2.0 SuperSpeed USB 3.0

eSATA / SATA DVI-D (single) HDMI • DisplayPort

SERIES 882 SuperFly ® Datalink The high-speed nano miniature connector for harsh environments

Push-Pull Quick-Disconnect

CONNECTOR CONFIGURATIONS

O-ring Interface Seal

Latching EMI Springs

Quick -disconnect “push-pull” versions are ideal for tactical gear. Threaded- coupling versions are intended for aircraft and space-grade applications where secure mating is a requirement.

882-001 Plug Connector

882-002 Receptacle Connector

Push-pull SuperFly Datalink receptacle connectors feature two canted coil springs for secure mating and excellent EMI protection. A fluorosilicone O-ring provides watertight sealing when mated.

Quick Disconnect

Cable Connector

Cable Sealing Grommet Backshell

O-ring

Retainer Clip

Threaded Coupling

Cable Shield Bushing

Spline

Inner Insulator

Straight PC Tails

Pin Contacts

Outer Insulator

Right Angle PC Tails

Coupling Nut and Shell Assembly

Conformal-coating- compliant panel mount connectors

Cable connectors feature gold-plated crimp contacts, precision insulators, integral backshell, sealing grommet and machined shells.

SPEED

f r i e n d s

PUZZLES

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PAYMENT

QwikConnect • July 2020

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STANDS ME 0 23456

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QwikConnect • July 2020

HIGH-SPEED RACK-AND-PANEL CONNECTOR WITH EL OCHITO ® OCTAXIAL CONTACTS

The next-generation micro miniature rectangular connector with El Ochito contacts for high- speed aerospace applications

The Series 792 connector brings high-speed data-rate performance to the Glenair Series 79 rectangular family. Size 8 cavities accept standard Quadrax or El Ochito ® shielded octaxial contacts making it a perfect choice for radars,

High-speed Ethernet, USB 3.0, HDMI, and DisplayPort PCB-mount and cable connectors Scoop-proof interface 12 arrangements and 6 shell sizes Precision-machined dual- lobe polarized shells Environmentally sealed Integrated EMI shielding and grounding Blind mating

weapons systems, mission computers and displays, communications gear, and more.

HIGH-SPEED Series 792

The next-generation micro miniature rectangular for high-speed / high-data rate aerospace applications

Save Size and Weight with Series 792 Connectors The Multi-Port Multi-Protocol Connector with El Ochito ® Contacts

About The Series 792 T he Series 792 brings high-speed board-to-wire capability to the Glenair Series 79 family of ultraminiature rectangular connectors. Developed in collaboration with NASA / JPL, the Series 792 is intended for avionics and space equipment exposed to high-vibration and hostile environments. The 792 supports quadrax contacts for ARINC 664 and El Ochito® octaxial contacts for 10Gb Ethernet, USB 3.0, HDMI and other protocols. Machined aluminum alloy shells feature dual lobes for polarization. Pin contacts are recessed to prevent scooping damage. Crimp contacts conform to M39029 requirements and are rear release. An optional ground spring in the receptacle minimizes EMI. Fluorosilicone face seals and wire grommets protect from moisture and contamination. Panel mount versions are available with an O-ring—or for improved panel bonding—a metal spring. Board mount versions include straight or right angle terminals. Right angle PCB connectors feature an aluminum cover for added EMI protection. Metal EMI Panel Spring A gold-plated panel spring option is available for Series 792 connectors with panel mount flanges. This spring provides improved electrical bonding.

Twinax, Quadrax and El Ochito ® Connectors are available in three configurations: twinax for a single high-speed wire pair, quadrax for two data pairs, and El Ochito® for four data pairs.

Up to 9 data ports The Series 792 Size F with nine ports is the largest connector in the series and is the only two row version. Sizes A – E, with one to five ports, are single row.

PCB Connectors Series 792 PCB connectors have straight or right angle PC tails. Contacts are non-removable and are epoxy sealed. Right-angle connectors eliminate the need for board-to-panel I/O jumpers.

Panel Mount Panel mount connectors have an O-ring and threaded mounting holes for easy installation. Suitable for blind mate modules, the Series 792 is available with guide pins and float mounts.

El Ochito® White GbE 10GbE

El Ochito® Blue

El Ochito® Red

USB 3.0 HDMI, SATA, DisplayPort

El Ochito® Contacts Series 792 connectors feature El

Cable Connectors Quadrax and El Ochito® contacts snap into Series 792 cable connectors and are easily removed with a standard plastic tool. Alignment keys provide correct orientation.

Ochito® octaxial contacts for Ethernet, SuperSpeed USB, HDMI, DisplayPort, SATA and other multi-gigabit protocols. Multiple protocols can be supported in a single multi-port connector.

NEXT-GENERATION HIGH-SPEED MICRO MINIATURE CONNECTORS

806 Mil-Aero : Advanced Performance, Reduced Size and Weight Connector Series IAW

SERIES 806

MIL-DTL-38999 MIL-AERO

Series 806 meets key performance benchmarks for harsh vibration, shock, and

environmental settings—as well as high-altitude, unpressurized aircraft zones with aggressive voltage ratings and altitude immersion standards.

Next-generation micro miniature aerospace- grade circular connector Upgraded environmental, electrical and mechanical performance IAW MIL-DTL-38999 Series III Integrated anti- decoupling technology High-Speed El Ochito® and hybrid #22HD contact arrangements

Series 806 with four 10GbE El Ochito channels

SERIES 806 MIL-AERO CONNECTORS WITH EL OCHITO ® CONTACTS

10GbE, SuperSpeed USB 3.0, HDMI and DisplayPort Crimp shield termination and threaded contact types Snap-in, rear release Environmentally protected

White GbE 10GbE

Blue USB 3.0

Red HDMI, SATA, DisplayPort

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